Dear IPC Members: I hope this newsletter finds you and yours doing well. It’s been a busy summer here at IPC. We recently saw significant movement on long-awaited, IPC-supported R&D and competitiveness legislation in the U.S. Congress. Stay tuned for upcoming opportunities to help advocate on additional legislation that affects our industry.

All the best,

Chris Mitchell
Vice President, Global Government Relations

The Headlines at a Glance: 

TOP NEWS OF THE WEEK 

• CHIPS+ Bill Passed with IPC’s Active Support
• Join IPC’s Advanced Packaging Symposium in October

DEFENSE AND SECURITY 

• USG Continues Efforts to Improve Trusted Supply Chains

ENVIRONMENT AND HEALTH

• Interested in Chemical and Product Regulations in the Asia-Pacific Region?
• Share Your Input on RoHS Exemption Fees with UK Regulators
• OSHA Issues Notice Limiting Workplace Lead Exposure

TAX, TRADE, AND SUPPLY CHAIN

• IPC Signs Joint Letter Opposing Reconciliation Taxes
• More than 100 Executives Join IPC Letter Supporting PCB Legislation

HELP US SPREAD THE WORD ON SOCIAL MEDIA

KEEP IN TOUCH WITH US

TOP NEWS OF THE WEEK

CHIPS+ Bill Passed with IPC’s Active Support: Last week, the U.S. Congress passed a slimmed down federal research and development (R&D) bill, including $52 billion in CHIPS Act funding for semiconductors, at least $2.5 billion for advanced packaging R&D, and additional measures to boost American R&D. IPC lobbied heavily for passage of the bill given the planned federal investments in advanced packaging and related needs. IPC applauds both the Senate and the House for reaching an agreement and sending the bill to President Joe Biden, which is expected to be signed within days. IPC Contact: Chris Mitchell.
 
Join IPC’s Advanced Packaging Symposium in October: IPC is hosting a conference October 11-12 in Washington, D.C., addressing opportunities and challenges for advanced packaging production in North America and Europe. The Advanced Packaging Symposium will include speakers from leading electronics companies, and we also anticipate the participation of senior government officials from the United States and Europe. Please reach out if you have questions about the event. IPC Contact: Ken Schramko.

DEFENSE AND SECURITY

USG Continues Efforts to Improve Trusted Supply Chains: The National Defense Industrial Association (NDIA) held a virtual briefing this week on Section 224 of the FY 2020 National Defense Authorization Act (NDAA), which required the U.S. Secretary of Defense to establish a new standard for acquiring microelectronics — now including covered printed circuit boards (PCBs) — by January 1, 2023. However, development of the Section 224 microelectronics standard has so far been beset by delays and complications. We will continue to keep you updated on this issue. IPC Contact: Ken Schramko.

ENVIRONMENT & HEALTH

Interested in Chemical and Product Regulations in the Asia-Pacific Region? China and the Philippines are the latest countries to undergo an updated deep dive by our Environmental and Health experts. Notably, China released a new plan to establish a comprehensive chemical substances environmental risk management system, while the Philippines shared final versions of Chemical Control Orders (CCOs) on a host of chemicals relevant to electronics. These are two of nine IPC white papers on the history of chemical regulations, current regulatory systems, and upcoming trends in the Asia-Pacific region. Let us know if you have any questions or concerns. IPC Contact: Kelly Scanlon.

Share Your Input on RoHS Exemption Fees with UK Regulators: The UK Department of Environment Food and Rural Affairs (DEFRA) is considering a new regulation that would impose an application fee for filing exemptions to the UK RoHS Directive. As a reminder, UK RoHS restricts the use of 10 hazardous substances found in electrical and electronic equipment (EEE). If you have thoughts on this issue, a DEFRA survey closes on August 26. Let us know if you have any questions. IPC Contact: Kelly Scanlon.

OSHA Issues Notice Limiting Workplace Lead Exposure: The Occupational Safety and Health Administration (OSHA) recently issued an advance notice of proposed rulemaking (ANPRM) to revise its standards for workplace exposure to lead (Pb). Lead can be found in solders used in electronics manufacturing; some facilities may be affected by this revised standard. Comments on modifying OSHA’s lead standards are due by August 29. Let us know if you have any questions or will be affected by this. IPC Contact: Kelly Scanlon.

TAX, TRADE, AND SUPPLY CHAIN

IPC Signs Joint Letter Opposing Reconciliation Taxes: This week, IPC joined over 130 national, state, and local business organizations in opposing proposed taxes in the reconciliation package currently being debated in the U.S. Congress. The letter, coordinated by the National Association of Manufacturers (NAM), was sent to every member of the U.S. Senate. Let us know if you have any questions. IPC Contact: Ken Schramko.

More than 100 Executives Join IPC Letter Supporting PCB Legislation: More than 100 top executives representing companies in the U.S. electronics manufacturing industry recently urged the U.S. Congress to address critical shortcomings in the printed circuit board (PCB) industry and the entire U.S. electronics supply chain. IPC is in process of scheduling meetings with congressional offices to highlight industry support for the bill — the Supporting American Printed Circuit Boards Act of 2022 — with the goal of bringing on at least two dozen cosponsors by year’s end. If you have not already, you can still make your voice heard at IPC’s Action Alert Center. IPC Contact: Ken Schramko.

HELP US SPREAD THE WORD ON SOCIAL MEDIA

“We are thrilled to take our long-lasting relationship with I-Connect007 to the next level and are committed to helping I-Connect007 further grow their readership globally and reach a wider audience.” IPC President and CEO John Mitchell comments on IPC’s acquisition of media company, I-Connect007, a global source for news and original content serving the printed circuit design, fabrication, and assembly/EMS markets.		Passage of the CHIPS+ Act by the U.S. Congress strengthens U.S. Electronics manufacturing and includes significant investment in advanced packaging. What does this mean for the industry? A recent IPC blog post explains and welcomes your participation in an upcoming Advanced Packaging Symposium to increase your knowledge.

KEEP IN TOUCH WITH US

Meet the IPC GR Team: Whether it’s engaging with policymakers in Washington, D.C., in the European Union or in China, the IPC Government Relations (GR) Team proactively seeks opportunities to educate, inform and influence policymakers on policies that spur innovation, growth and competition, while protecting human health and the environment. But our success depends on your support and engagement. Learn more and get involved in IPC advocacy today! IPC Contact: Chris Mitchell.

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