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Dear IPC Members:
We are less than two weeks away from IPC’s Advanced Packaging Symposium. The symposium, to be held October 11-12 in Washington, D.C., will feature a top-notch roster of speakers discussing the importance of advanced packaging initiatives to the success of the CHIPS for America Act. Register for the two-day conference today! |
Elsewhere, our message about how governments need to take a holistic approach to supporting electronics manufacturing is getting through in Washington, judging by the first batch of industry leaders named to a new U.S. Commerce Department advisory committee on the CHIPS for America programs. Our industry is well represented on the new panel. Read more below.
As always, please remain engaged with your legislators! If you need guidance on how to start, or want to see the latest opportunities, head over to the IPC Advocacy Team web page.
All the best,
Chris Mitchell
Vice President, Global Government Relations
The Headlines at a Glance:
TOP NEWS OF THE WEEK
- Industry Well Represented on New U.S. Government Advisory Committee
- IPC Continues Advanced Packaging Advocacy with European Policymakers
- Secure your Spot at IPC’s Advanced Packaging Symposium in October
QUOTE OF THE WEEK
- IPC’s Shawn DuBravac Shares an Update on the State of the European Economy
ENVIRONMENT AND HEALTH
- ECHA Seeks to Designate Flame Retardant as SVHC
- Vietnam Proposes Restriction of Four Phthalates in New Regulation
TRADE AND SUPPLY CHAIN
- Likelihood of a Global Recession May Be Rising
- IPC Calls for Biden Administration to Address Industrial Base Vulnerabilities
HELP US SPREAD THE WORD ON SOCIAL MEDIA
KEEP IN TOUCH WITH US
TOP NEWS OF THE WEEK
Industry Well Represented on New U.S. Government Advisory Committee: Two electronics industry leaders have been named to the U.S. Department of Commerce’s new Industrial Advisory Committee (IAC), which will provide guidance to the Secretary of Commerce on a range of issues related to CHIPS for America Act programs. Meredith LaBeau, the Chief Technology Officer at Calumet Electronics, and Carol Handwerker, professor of Materials Engineering at Purdue University, are among the first batch of nominees to be named. Both Handwerker and LaBeau have participated in IPC’s Thought Leaders Program, standards development committees, and other IPC activities. IPC and the U.S. Partnership for Assured Electronics (USPAE) jointly nominated the pair, and our industry is also well represented by several others from IPC member companies Analog Devices, Microsoft, and Intel. IPC Contact: Ken Schramko.
IPC Continues Advanced Packaging Advocacy with European Policymakers: In remarks to IPC members last week, Member of the European Parliament (MEP) Eva Maydell expressed support for a European Chips Act that would bolster the entire semiconductor ecosystem, including segments critical to advanced packaging. IPC will continue to meet with European policymakers like MEP Maydell to highlight the strategic importance of Europe’s electronics manufacturers. Please let us know if you are interested in learning more about IPC’s efforts in Europe and read more in a new IPC blog. IPC Contact: Alison James.
Secure your Spot at IPC’s Advanced Packaging Symposium in October: IPC is hosting a conference October 11-12 in Washington, D.C., addressing opportunities and challenges for advanced packaging production in North America and Europe. The Advanced Packaging Symposium will feature a powerful lineup of speakers from leading electronics companies and government agencies in the United States and Europe. Please register today or reach out if you have questions. IPC Contact: Ken Schramko.
QUOTE OF THE WEEK
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“Inflation in Europe has not yet peaked.”
– Spend five minutes with IPC Chief Economist Shawn DuBravac as he provides an update on the state of the economy in Europe as it continues to grapple with inflation. |
ENVIRONMENT & HEALTH
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ECHA Seeks to Designate Flame Retardant as SVHC: The European Chemical Agency (ECHA) recently proposed that nine new substances, including Tetrabromobisphenol-A (TBBPA), be classified as a substance of very high concern (SVHC), which would trigger adherence to REACH requirements. TBBPA is used in electronics and is critical to flame retardancy for some types of printed circuit boards (PCBs). The consultation closes on October 17. Please let us know if you have any data or information relevant to TBBPA. IPC Contact: Kelly Scanlon.
Vietnam Proposes Restriction of Four Phthalates in New Regulation: In August, the Vietnam Ministry of Industry and Trade (MoIT) released a draft of a new Restriction of Hazardous Substances (RoHS) regulation that would add four new phthalates used in electrical and electronic equipment (EEE) to the restriction list. If adopted, the new regulation will come to effect in January 1, 2026. The public consultation will end on October 17. Let us know if you have any questions. IPC Contact: Kelly Scanlon.
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TRADE AND SUPPLY CHAIN
Likelihood of a Global Recession May Be Rising: IPC’s latest report on the global economic outlook suggests that the economic picture in the United States continues to dim, and the likelihood of a recession next year continues to increase. While inflation has likely peaked in the United States, this is not the case in Europe, where the picture is dimmer. For more on what might lie ahead, be sure to check out IPC Chief Economist Shawn DuBravac’s Monthly Economic Outlook Report. IPC Contact: Shawn DuBravac.
IPC Calls for Biden Administration to Address Industrial Base Vulnerabilities: IPC, alongside U.S. Partnership for Assured Electronics (USPAE) and the Printed Circuit Board Association of America (PCBAA), recently called on U.S. President Joe Biden to prioritize domestic development of printed circuit boards (PCBs) and IC substrates under the Defense Production Act. Specifically, the letter urged Biden to issue a presidential determination, which would be a key step toward rebuilding the U.S. electronics manufacturing industry. IPC Contact: Chris Mitchell.
HELP US SPREAD THE WORD ON SOCIAL MEDIA
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Join us on October 11 for the IPC Advanced Packaging Symposium! Keynote speaker Dr. Devanand Shenoy, principal director for microelectronics at the U.S. Department of Defense, will provide the defense perspectives on the challenges of strengthening the IC-substrate and packaging assembly ecosystem. Secure your spot today. |
Environmental, social, and governance (ESG) reporting has gained significant momentum in the electronics manufacturing industry, with climate change and energy use closely scrutinized, according to IPC analysis. Details on IPC’s ESG for Electronics initiative and results of the study can be found in the IPC blog. |
KEEP IN TOUCH WITH US
Meet the IPC GR Team: Whether it’s engaging with policymakers in Washington, D.C., in the European Union or in China, the IPC Government Relations (GR) Team proactively seeks opportunities to educate, inform and influence policymakers on policies that spur innovation, growth and competition, while protecting human health and the environment. But our success depends on your support and engagement. Learn more and get involved in IPC advocacy today! IPC Contact: Chris Mitchell.
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