IPC Global Advocacy Report

12/2/2022

Dear IPC Members:

Happy December!

To my colleagues in the United States, I hope everyone enjoyed a safe and happy Thanksgiving.

In Washington, time is running out for the U.S. Congress to complete several priorities before the end of the year, including funding the government beyond December 16; finalizing the annual defense authorization bill; and increasing the debt ceiling.

Elsewhere, European policymakers have been busy addressing issues as varied as semiconductor competitiveness and resilience; packaging and waste restrictions; and new sustainability reporting rules for large companies. See EUROPEAN UNION below for a full rundown of all the latest legislative activity.

Please browse our advocacy pages, follow IPC on social media, or contact IPC’s Government Relations (GR) team if you have any questions or suggestions. We always welcome your thoughts and feedback, especially now with 2023 right around the corner!

All the best, and continue to stay safe,

 

Chris Mitchell
Vice President, Global Government Relations

 

The Headlines at a Glance: 

TOP NEWS OF THE WEEK 

  • Pledge to Help IPC Advocate for Our Industry in 2023-24

QUOTE OF THE WEEK 

  • IPC’s John W. Mitchell Discusses Global Efforts to Seek Government Support for Advanced Packaging

ENVIRONMENT AND HEALTH

  • Industry Seeks Extension on Maine PFAS Reporting Requirement
  • Philippines Releases New Regulations on Two Chemicals

IPC ADVOCACY AND YOU

  • IPC Team Takes On-Site Visit to Manufacturing Facility

ENVIRONMENT AND HEALTH

  • EPA Proposes Changes to TSCA Fees Rule
  • Would GHG and Climate Disclosure Requirements Affect You?
  • ECHA to Consider Restriction of Bisphenol A

EUROPEAN UNION

  • Commission Releases Proposal Targeting Packaging and Waste
  • EU Ambassadors Reach Agreement on EU Chips Act
  • EU Council Adopts New Reporting Rules

TRADE AND SUPPLY CHAIN

  • Build It and They Will Come

HELP US SPREAD THE WORD ON SOCIAL MEDIA

KEEP IN TOUCH WITH US


TOP NEWS OF THE WEEK

Pledge to Help IPC Advocate for Our Industry in 2023-24: The IPC Government Relations (GR) team is composed of experienced professionals working for you year-round. But our success depends on active participation from IPC members like you. With the November elections now behind us, our 2023 advocacy efforts are coming up soon. Please click here to confirm your contact details and pledge to stay involved in IPC advocacy. We will send you information and timely action alerts, and we will make it easy to communicate with your elected officials with just a few clicks. IPC Contact: Chris Mitchell.

 

QUOTE OF THE WEEK

“Governments globally are marshaling resources to make semiconductor industries more competitive in the global marketplace.”
IPC President and CEO John W. Mitchell explains how IPC is working with the global electronics manufacturing industry to ensure that governments focus on advanced packaging and the rest of the electronics ecosystem.

IPC ADVOCACY AND YOU

IPC Team Takes On-Site Visit to Manufacturing Facility : In our ongoing efforts to better understand IPC members and the exciting changes occurring in our industry, the IPC Advocacy team recently visited the Zentech Manufacturing facility near Baltimore, MD, where we viewed their impressive, high-tech manufacturing operations. Topics discussed included the need for financing for equipment upgrades; and the need for more skilled labor. This was our first on-site visit since the COVID-19 pandemic began, and we look forward to further visits to our member companies in the future. IPC Contact: Chris Mitchell.

ENVIRONMENT & HEALTH

EPA Proposes Changes to TSCA Fees Rule: On November 18, the U.S. Environmental Protection Agency (EPA) released a proposed rule that would significantly increase fees for EPA-initiated risk evaluations of existing chemicals under the Toxic Substances Control Act (TSCA). The EPA undergoes 20 to 30 risk evaluations each year, and even if the current list of chemical substances does not apply to your company, future lists may apply, and you may be obligated to pay at that time. In March 2021, IPC responded to the EPA’s proposed rule and acknowledged the importance of the fee rule to the electronics industry. The EPA will accept public comments on the proposed rule until January 17, 2023. IPC Contact: Kelly Scanlon.
 
Would GHG and Climate Disclosure Requirements Affect You? On November 10, the Federal Acquisition Regulatory (FAR) Council released a proposed rule that would require federal contractors to disclose their greenhouse gas (GHG) emissions. The rule would apply to all contractors receiving more than $7.5 million in annual federal contracts, while contractors that exceed $50 million would be further required to set emission reduction targets in line with the Paris Agreement. Comments on the rule are due by January 13, 2023. IPC Contact: Kelly Scanlon.

ECHA to Consider Restriction of Bisphenol A: The European Chemicals Agency (ECHA) is currently considering a German proposal that would restrict the use of Bisphenol A (BPA) and bisphenols of similar concern, which are found in epoxy resins and have utility in electronics. The ECHA will now evaluate the proposal and determine whether it conforms with the legal requirements of Registration, Evaluation, Authorisation, and Restriction of Chemicals (REACH). Is BPA essential to your electronics-related manufacturing processes or electronics products? Please let us know. IPC Contact: Kelly Scanlon.

 

EUROPEAN UNION

Commission Releases Proposal Targeting Packaging and Waste: The European Commission recently released a new proposal that would reduce emissions and address packaging and waste. Under the new rule, which is seen as key to the implementation of the Circular Economy Plan, all packaging products would have to be recyclable. The proposal further aims to decrease packaging waste 5% by 2030 and 10% by 2035. The proposal will now be considered by the European Parliament and the Council. IPC Contact: Kelly Scanlon

EU Ambassadors Reach Agreement on EU Chips Act: On November 25, EU ambassadors reached on an agreement on legislation to bolster the bloc’s competitiveness and resilience in semiconductor technologies and applications. The €43 billion ($44.4 billion) agreement, called the EU Chips Act, largely mirrors the European Commission’s proposal put forward in February, but “expands the scope of what chip plants are considered ‘first-of-a-kind' and qualify for state aid,” Bloomberg reports. The text also cites packaging as an activity that can boost innovation. The EU Parliament is expected adopt its own plan in February 2023. IPC Contact: Alison James.

EU Council Adopts New Reporting Rules: This week, the EU Council approved a rule aiming to strengthen the reporting requirements for sustainability information of certain large companies. The Corporate Sustainability Reporting Directive (CSRD) will require companies to publish detailed information on sustainability matters, including climate change, human rights, and other governance factors. The CSRD is expected to affect the electronics industry with regards to resources and reporting and transparency efforts across the value chain. Let us know if you have any questions. IPC Contact: Kelly Scanlon


TRADE AND SUPPLY CHAIN

Build It and They Will Come: A recent IPC report showed that electronics manufacturing industry leaders are likely to purchase domestically available, advanced IC-package substrates and IC-package assembly from U.S. suppliers if it were cost-competitive. Only 6% of industry leaders reported that they would not to buy cost-competitive advanced IC substrates if they were available from U.S. suppliers. Let us know if you have any questions. IPC Contact: Chris Mitchell.


HELP US SPREAD THE WORD ON SOCIAL MEDIA

 

“For the past year, we’ve been advocating for the idea that the silicon must interconnect with something. You can spend $20 billion on a fab and it’s impressive. You take all that money and technology, and you have a pile of very advanced chips on your desk, but they’re completely useless.” IPC Chief Technologist Matt Kelly discusses the payoffs and challenges of investing in ultra-high density interconnect (UHDI) technology in the latest issue of PCB007 magazine.

IPC recently urged the U.S. Department of Commerce to invest in advanced packaging, supply chain partnerships, high-density interconnects, and industry-recognized workforce programs to maximize the impact of CHIPS Act Incentive Program. For details, see IPC’s blog.

KEEP IN TOUCH WITH US

Meet the IPC GR Team: Whether it’s engaging with policymakers in Washington, D.C., in the European Union or in China, the IPC Government Relations (GR) Team proactively seeks opportunities to educate, inform and influence policymakers on policies that spur innovation, growth and competition, while protecting human health and the environment. But our success depends on your support and engagement. Learn more and get involved in IPC advocacy today! IPC Contact: Chris Mitchell.

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