IPC Global Advocacy Report
10/6/2023

Dear IPC Members:

Here is your weekly, five-minute read on what your IPC Government Relations team is watching and doing on your behalf.  

In Spain this week, leaders from across the European Union gathered in Granada to discuss the EU’s strategic agenda. The timing of the meeting and the EU’s evolving approaches to open strategic autonomy provided an opportunity to renew the focus on IPC’s recent report calling for a “silicon-to-systems” approach to electronics policy development.

Meanwhile in Washington, the U.S. Partnership for Assured Electronics (USPAE), an IPC subsidiary, announced funding awards from the Department of Defense for two significant initiatives: competitive grants for the development of innovative “dual use” electronics, and a new business model to foster development of advanced PCBs. These DOD awards resulted from a successful, long-term effort by our industry to educate government leaders on the strategic value of our industry and the need for new policies and funds to revive it in the United States.   

Please read on to learn more about those efforts and much more – and let us know your thoughts and questions.  

All the best,

Chris Mitchell
Vice President, Global Government Relations

 

The Headlines at a Glance: 

TOP NEWS OF THE WEEK 

  • DBX Program Launched for Dual Use Electronics Development
  • USPAE Announces Planning Sprint for PCB Market Catalyst

QUOTE OF THE WEEK 

  • IPC’s Alison James on the Need for an EU Silicon-to-Systems Policy

IPC ADVOCACY AND YOU

  • IPC Brings Funding, Workforce Message to Capitol Hill
  • North American Government Relations Committee Reconvenes

ENVIRONMENT AND HEALTH

  • U.S. EPA Finalizes Rule on PFAS Reporting Requirements
  • IPC Seeks Reasonable Timeline for PFAS Transition in Europe

EUROPEAN UNION

  • IPC Renews Call for Silicon-to-Systems EU Industrial Strategy
  • European Chips Act Enters into Force

UPCOMING EVENTS

  • IPC CEMAC 2023, Shanghai, October 27

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TOP NEWS OF THE WEEK

DBX Program Launched for Dual Use Electronics Development: The U.S. Department of Defense on Sept. 28 announced funding for the Defense Business Accelerator (DBX), a program being launched by the U.S. Partnership for Assured Electronics (USPAE), an IPC subsidiary. The DBX will offer up to 10 grants of $500,000 to $2 million each for innovative, “dual use” electronics with applications in both the private sector and national security. The DoD chose USPAE to lead this effort due to its track record in bringing together leaders of government and the U.S. electronics industry. DBX is the culmination of significant work in raising government awareness of the need for a stronger and more resilient electronics industrial base. The deadline for grant applications is October 12. Learn more and start your company’s application here. USPAE Contact: Nathan Edwards.
 
USPAE Announces Planning Sprint for PCB Market Catalyst: With funding from the U.S. Department of Defense, the USPAE also announced it is developing a new business model that could support advanced PCB manufacturing growth through services, workforce development, and research. The funding award is a reflection of the industry’s collective efforts to educate government leaders on the importance of domestic capabilities for UHDI PCB development and manufacturing. Industry veteran Joe O’Neil is leading a “planning sprint” to gather input from the industry to shape the long-term initiative. Learn more and lend your insights at www.uspae.org/PCBMarketCatalyst.


QUOTE OF THE WEEK

“Electronics manufacturing is central to the four critical technologies highlighted in the Commission’s proposal, although key segments of electronics manufacturing in Europe have atrophied, undermining the region’s resiliency, security, and economic competitiveness.”
 Statement by IPC’s Alison James, calling for a “silicon-to-systems” approach to rebuilding Europe’s electronics sectors.  

IPC ADVOCACY AND YOU

IPC Brings Funding, Workforce Message to Capitol Hill: At the NIST CHIPS R&D Standards Summit last week and in meetings on Capitol Hill, at the White House, and across Washington, Matt Kelly, IPC vice president of technology solutions, and Dave Hernandez, IPC vice president of education, urged U.S. policy makers to take a “silicon-to-systems” approach to CHIPS Act implementation and to step up efforts to build a high-skilled workforce for the industry’s needs. Kelly called for full funding to implement the Presidential Determination that PCBs are a vital national security interest, while Hernandez advocated for reauthorization of the Workforce Innovation and Opportunity Act and tax credits and incentives for training and certification. Read more about their presentations and visits to Capitol Hill on the IPC Blog. IPC Contact: Rich Cappetto.

North American Government Relations Committee Reconvenes: Last week, members of the IPC North American Government Relations Committee met after a long hiatus for the committee. Rich Cappetto, who recently joined IPC as senior director for North American Government Relations, reconvened the advisory committee, which is chaired by Dan Weber from TTM Technologies. Discussions covered IPC’s new initiative to uncover government grant opportunities for its members; new workforce development initiatives, including two recently approved Registered Apprenticeships; and advocacy activities including those on PFAS restrictions and U.S. Government funding plans for PCBs and advanced packaging. The outlines of IPC’s 2024 government relations strategy were also presented. IPC Contact: Rich Cappetto.

 

ENVIRONMENT, HEALTH, AND SUSTAINABILITY

EPA Finalizes Rule on PFAS Reporting Requirements: The U.S. Environmental Protection Agency (EPA) finalized the reporting and recordkeeping requirements for per- and polyfluoroalkyl substances (PFAS) Thursday. The final rule defines the scope of PFAS, the timelines for reporting, and the industries that are obligated to report under the Toxic Substances Control Act (TSCA). IPC worked with the Consumer Technology Association (CTA) and Information Technology Industry Council (ITI) to submit comments to EPA during the proposed rulemaking process and we will continue to work together to review the meaning of this rule on the electronics manufacturing industry. Contact: Kelly Scanlon.

IPC Seeks Reasonable Timeline for PFAS Transition in Comments to ECHA: Responding to a request for comments from the European Chemicals Agency (ECHA) on the proposed restriction on all per- and polyfluoroalkyl substances (PFAS), IPC advocated for a minimum 13.5-year derogation to the proposed REACH Restriction on PFAS. The proposal, as written, would ban the manufacture, placing on the market, and use of all PFAS. IPC, in its response, highlights the complexity of the electronics manufacturing supply chain and the cascade of utility that potential PFAS containing electronics products provide to society. To identify where PFAS is in electronics and determine effective alternatives and undergo alternatives assessments, more time is needed. IPC continues to stay updated on the proposal as it moves it forward. Contact: Kelly Scanlon.

 

EUROPEAN UNION

IPC Renews Call for Silicon-to-Systems EU Industrial Strategy: As European political leaders gather in Granada, Spain, to discuss the EU’s Strategic Agenda for a resilient EU, and as the European Commission released its Recommendation on Critical Technologies for Economic Security, IPC reiterated its call for an EU “silicon-to-systems” industrial strategy. IPC highlighted this summer’s industry-curated analysis on the need to bolster Europe’s PCB and EMS industries, a report that was supported by a broad European stakeholder base and prepared at the request of the European Commission. IPC is continuing to pursue next steps following the report. IPC Contact: Alison James.

European Chips Act Enters into Force: The European Chips Act legally entered into force on Sept. 21, together with the regulation establishing the Chips Joint Undertakings (Chips JU) as part of an expanded Key Digital Transitions JU. IPC welcomes this milestone, which includes advanced packaging, and we continue to work on next steps to reinforce the European electronics manufacturing ecosystem from “silicon to systems.” Together with members and partners, IPC will continue to build on IPC’s electronics industry stakeholder report, produced at the request of DG GROW. IPC Contact: Alison James.


UPCOMING EVENTS

IPC CEMAC 2023: Shanghai, Oct.27. IPC CEMAC (China Electronics Manufacturing Annual Conference), co-organized with Pudong New Area Association for Quality and Technology Shanghai, will feature discussions with experts on IPC standards, automotive electronics, advanced packaging, the factory of the future, talent cultivation and sustainability, and innovative products and solutions. An IPC member awards and appreciation dinner will be held as well. Event registration.

 

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IPC provides European Commission with in-depth study on need for silicon to systems industrial strategy. At the European Commission’s request, IPC recently submitted a landmark analysis of the European electronics manufacturing industry. Read report.

KEEP IN TOUCH WITH US 

Meet the IPC GR Team: Whether it is engaging with policymakers in the Americas, the European Union, or Asia, the IPC Government Relations (GR) Team proactively seeks opportunities to educate, inform and influence policymakers on policies that spur innovation, growth and competition, while protecting human health and the environment. But our success depends on your support and engagement. Learn more and get involved in IPC advocacy today! IPC Contact: Chris Mitchell.   

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