Chris Mitchell
Vice President, Global Government Relations

The Headlines at a Glance: 

TOP NEWS OF THE WEEK 

• IPC Applauds Committee Passage of Workforce Development Bills

QUOTE OF THE WEEK 

• IPC’s John W. Mitchell on Need to Invest in Technician Education

EUROPEAN UNION

• IPC Continues Push to Reduce Reporting Burden for EU Manufacturers
• Chips Joint Undertaking Launches

TRADE AND SUPPLY CHAIN

• IPC Meets with Members of Congress to Discuss Industry’s Future
• IPC Applauds New U.S. Strategy for Advanced Packaging
• U.S. President Takes Actions on Supply Chain Resilience

UNITED STATES

• IPC Earns Federal Recognition for Apprenticeship Standards

UPCOMING EVENTS

• IPC WinterCom 2024, Jan. 22-25
• WHMA Global Leadership Summit, Feb. 13-15
• IPC APEX EXPO 2024, April 6-11

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TOP NEWS OF THE WEEK

IPC Applauds Committee Passage of Workforce Development Bills: A U.S. House committee this week approved two bills that would help alleviate the workforce skills gap challenging electronics manufacturers. The Stronger Workforce for America Act (H.R. 6655) and the Bipartisan Workforce Pell Act (H.R. 6858) seek to bridge the skills gap by, among other mechanisms, providing funding for adults and dislocated workers for skills development, and allocating Pell Grants to be used for training that leads to industry credentialling. Despite adding more than 75,000 jobs over the last five years, the electronics industry continues to face steep challenges in finding skilled workers. IPC applauds the Committee’s effort to open new paths to skills development, especially as the CHIPS and Science Act creates more demand for skilled workers. IPC will continue to monitor the bills’ progress through the House and will advocate for similar legislation the Senate. IPC Contact: Rich Cappetto.

QUOTE OF THE WEEK

“Time and time again, it has been shown that there is a strong need for technically capable operators. Most technical companies are hiring operators, and to be honest, there is almost an equivalent need for engineers. However, the unsung priority need is technicians — taking the best operators, training them, and growing them into technicians.” – John W. Mitchell, IPC President and CEO, writing in Forbes on the skilled professional shortage.

EUROPEAN UNION

IPC Continues Push to Reduce Reporting Burden for EU Manufacturers: IPC last week re-emphasized the importance of reducing reporting burdens on electronics manufacturers in the European Union. The statement followed IPC’s submission of feedback to the European Commission’s Industrial Forum last spring, which responded to the European Commission’s call for evidence on the EU reporting requirements that cause the most administrative burden. IPC will continue to engage with the European Commission to support its goal to reduce reporting requirements by 25%. IPC contact: Alison James.

Chips Joint Undertaking Launches: Following the official entry into force of the European Chips Act at the end of September, the Chips Joint Undertaking (Chips JU) – the public/private body managing the research, development, and innovation (R&D&I) projects at the EU level – launched at the end of November. The Chips JU succeeds the former Key Digital Technologies Joint Undertaking (KDT-JU) and will manage, among other items, “pillar 1” R&D&I activities under the European Chips Act.  IPC was present at the launch meetings this week and will continue to highlight the importance of a “silicon to systems” approach to building capacities and capabilities in the region. IPC Contact: Alison James.

TRADE AND SUPPLY CHAIN

IPC Meets with Members of Congress to Discuss Industry Future: IPC President and CEO John W. Mitchell recently met with key members of the U.S. House of Representatives on the heels of an IPC summit with leaders of the electronics manufacturing services (EMS) sector. In the meetings, John urged a strong and diverse workforce development strategy, spotlighting the skills gap that could hinder the success of federal investments in the industry. He also advocated for a better focus on the entire electronics manufacturing ecosystem, not just semiconductor chips. John and others from IPC met with Rep. Brad Schneider (D-IL), an industrial engineer and management consultant whose district includes IPC’s headquarters; Rep. Jay Obernolte (R-CA), a computer engineer; and Rep. Mike Collins (R-GA), chairman of the House Subcommittee on Research and Technology, with whom John discussed some of the innovative work of IPC member Absolics in the congressman’s district in Convington, Ga. IPC contact: Rich Cappetto.

IPC Applauds New U.S. Government Strategy for Advanced Packaging: On Nov. 20, the U.S. Commerce Department released the “Vision for the National Advanced Packaging Manufacturing Program,” under which approximately $3 billion from the CHIPS and Sciences Act will be used to drive U.S. leadership in advanced packaging, with an initial funding opportunity to be announced in early 2024. IPC has been the leading advocate of a “silicon-to-systems” approach to CHIPS Act implementation, and we’re encouraged by this vision to expand U.S. advanced packaging, PCB fabrication, and electronics assembly. While the plan is not fully up to the level needed to truly strengthen the domestic electronics supply chain, it’s a foundation upon which IPC will continue to advocate for a robust ecosystem approach to electronics manufacturing investments. IPC Contact: Chris Mitchell.

U.S. President Takes Actions on Supply Chain Resilience: On Nov. 27, U.S. President Joe Biden convened the inaugural meeting of the White House Council on Supply Chain Resilience, pulling together leaders of multiple federal agencies to advance a long-term, government-wide strategy for building enduring supply chains in all industries. Part of the council’s charge will be to produce a quadrennial review of the nation’s supply chain, including in sectors critical to national and economic security. IPC applauds the strategy’s emphases on solidifying the U.S. defense industrial base and enhancing international cooperation. IPC welcomes this executive focus on the U.S. supply chain as an antidote to the extreme disruptions we’ve experienced in recent years from pandemics, geopolitics, and natural disasters. Read more about the Council’s charge and responsibilities. IPC contact: Rich Cappetto.

IPC Applauds New U.S. Government Strategy for Advanced Packaging: On Nov. 20, the U.S. Commerce Department released the “Vision for the National Advanced Packaging Manufacturing Program,” under which approximately $3 billion from the CHIPS and Sciences Act will be used to drive U.S. leadership in advanced packaging, with an initial funding opportunity to be announced in early 2024. IPC has been the leading advocate of a “silicon-to-systems” approach to CHIPS Act implementation, and we’re encouraged by this vision to focus on growth in advanced packaging, PCB fabrication, and electronics assembly. While the plan is not fully to the level needed to truly strengthen the domestic electronics supply chain, it’s a foundation upon which IPC will continue to advocate for a robust ecosystem approach to electronics manufacturing investments. IPC Contact: Chris Mitchell.

U.S. President Takes Actions on Supply Chain Resilience: On Nov. 27, U.S. President Joe Biden convened the inaugural meeting of the White House Council on Supply Chain Resilience, pulling together the secretaries and representatives from multiple federal agencies to advance a long-term, government-wide strategy for building enduring supply chains in all industries. Part of the council’s charge will be to produce a quadrennial review of the nation’s supply chain, including in sectors critical to national and economic security. IPC applauds the strategy’s emphases on solidifying the U.S. defense industrial base and enhancing international cooperation. IPC welcomes this executive focus on the U.S. supply chain as an antidote to the extreme disruptions we’ve experienced in recent years from pandemics, geopolitics, and natural disasters. Read more about the Council’s charge and responsibilities.

UNITED STATES

U.S. Department of Labor Approves IPC Apprenticeship Standards: On Nov. 15, IPC President and CEO John W. Mitchell was hosted by Megan Baird, Deputy Administrator of the Office of Apprenticeship at the U.S. Department of Labor, for a signing ceremony to recognize IPC’s National Program Standards of Apprenticeship. These standards are the first in the electronics industry to be approved on the federal level, recognizing our industry’s need for more skilled workers and IPC’s leadership in workforce training. Read more in this IPC Blog and learn how your company can get involved. IPC contact: Cory Blaylock.

IPC WinterCom 2024: Barcelona, Spain, Jan. 22-25. A new event to support IPC standards development committees in face-to-face sessions, WinterCom 2024 will convene colleagues from around the globe for a week of meetings. The event is free to both IPC members and non-members with an interest in IPC standards development. Register today!

WHMA Global Leadership Summit: Myrtle Beach, S.C., Feb. 13-15. Formerly the WHMA Annual Conference, the WHMA's Annual Global Leadership Summit is a networking event for executives representing wire harness manufacturers, OEMs, and suppliers for companies that build wiring harnesses and cable assemblies. Keynote presentations will address leadership and workplace culture as well as emerging trends reshaping the electronics industry. Register today!

IPC APEX EXPO 2024: Anaheim, Calif., April 6-11. The largest electronics manufacturing event in North America, APEX features the newest innovations and the best minds in the industry. APEX 2024 will also host the Electronic Circuits World Convention 16, an international PCB symposium held every three years, featuring the latest information on global PCB demand, PCB manufacturing processes, and promoting the domestic PCB industry in every country and every region. Register by March 1 for a 20% discount!

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IPC commends the House Education and the Workforce Committee Chairwoman Virginia Foxx and Ranking Member Congressman Bobby Scott for passing two key bills out of Committee - H.R. 6655 A Stronger Workforce for America Act and H.R. 6858 Bipartisan Workforce Pell Act.   In the last five years, the electronics manufacturing industry has added more than 75,000 jobs. Yet, more than two-thirds of IPC members report that finding and retaining skilled workers is among their greatest challenges. This workforce gap is limiting their growth and competitiveness in the global market. These bills offer improvements to our nation’s workforce development system that will help the electronics industry to build pipelines of talent.		Did you miss the webinar on the EPA PFAS reporting rule on electronics manufacturing? Speakers Ryan Carra and Russ LaMotte from law firm Beveridge & Diamond provided an overview of the new one-time EPA reporting rule on PFAS under the Toxic Substances Control Act (TSCA).

KEEP IN TOUCH WITH US 

Meet the IPC GR Team: Whether it is engaging with policymakers in the Americas, the European Union, or Asia, the IPC Government Relations (GR) Team proactively seeks opportunities to educate, inform and influence policymakers on policies that spur innovation, growth and competition, while protecting human health and the environment. But our success depends on your support and engagement. Learn more and get involved in IPC advocacy today! IPC Contact: Chris Mitchell.   

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