IPC Global Advocacy Report

3/1/2024

Dear IPC Members:

Here's your weekly update from the IPC Government Relations team.

The big news this week: Yesterday, IPC applauded the U.S. Government's new funding opportunity for advanced packaging substrate technologies, which will reinforce semiconductor supply chain resilience. The $300 million initiative comes in response to IPC's advocacy for an ecosystem approach to the CHIPS for America program.

And once again, U.S. Commerce Secretary Gina Raimondo stated her belief in the “silicon-to-systems” approach to implementing the CHIPS and Science Act. Read more below.

On a similar note, Fierce Electronics published an interview with IPC on the U.S. CHIPS and Science Act. We discussed growing industry concerns about the act’s $39 billion in domestic chip manufacturing incentives, underscoring that it doesn’t support the entire electronics pipeline, especially the manufacturing of PCBs and IC substrates.

The European Commission has spotlighted advanced materials in new report, which outlines its proposed strategy to cultivate industrial leadership. In Japan, a proposed initiative to designate PFOA compounds as hazardous chemicals could affect some IPC members.

As always, we invite you to reach out with any feedback or questions.

All the best,

Chris Mitchell
Vice President, Global Government Relations

 

The Headlines at a Glance: 

TOP NEWS OF THE WEEK 

  • IPC Applauds USG Funding Opportunity for Advanced Packaging Tech

QUOTE OF THE WEEK 

  • On the Need for More Entry Points into the Workforce

DEFENSE & SECURITY

  • U.S. Defense Official Says Industrial Strategy Key to National Security

ENVIRONMENT AND HEALTH

  • Japan Seeks Public Input on Designating PFOA Compounds as Hazardous

TECHNOLOGY

  • U.S. Commerce Secretary Again Sees Beyond Just Chips
  • European Commission Spotlights Advanced Materials in New Report

TRADE AND SUPPLY CHAIN

  • European Commission Spotlights EU Competitiveness in New Report

UPCOMING EVENTS

  • Navigating Plastics Use and Management in the Electronics Value Chain, March 27
  • IPC APEX EXPO 2024, April 6-11

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KEEP IN TOUCH WITH US

 

TOP NEWS OF THE WEEK

IPC Applauds U.S. Government's Funding Opportunity for Advanced Packaging Technologies: IPC is applauding the issuance of a notice of funding opportunity by the CHIPS for America R&D Office, through the National Institute of Standards and Technology (NIST), allocating $300 million for R&D on advanced packaging substrates and materials. It’s a major milestone in the effort to enhance U.S. supply chain resilience and to revive U.S. leadership in electronics manufacturing. Funding will be available for projects that accelerate domestic R&D, translate innovations into manufacturing, and stimulate workforce development. These priorities align with IPC's advocacy for a “silicon-to-systems" approach to implementing the CHIPS and Science Act. On a related note, Dr. Chris Greer of the CHIPS for America R&D Office was IPC’s guest on this week’s North American Executive Forum call, during which he provided insights on the strategy and implementation of the National Advanced Packaging Manufacturing Program (NAPMP). Read the IPC news release. IPC Contact: Rich Cappetto.

 

QUOTE OF THE WEEK

From my perspective, it’s clear the traditional path from education to career has evolved. The days of one-size-fits-all entry points into the workforce are gone forever. In its place, we have incredible internships and apprenticeships that are paving the way. Apprenticeships offer specialized training, propelling careers forward. It's about curating expertise, not just a wall of degrees.”

Dr. John W. Mitchell, IPC President and CEO, on the need for more entry points into the workforce. Read more on John’s blog and learn more about IPC’s apprenticeship programs.

 

DEFENSE AND SECURITY

U.S. Defense Official Says Industrial Strategy Is Key to National Security: In an article in Defense One, Dr. Laura Taylor-Kale, U.S. Assistant Secretary of Defense for Industrial Base Policy, underscored the critical importance of a robust defense industrial ecosystem in deterring potential adversaries. In her analysis, she highlights how the United States' industrial might not only safeguards national security but also ensures victory in conflict. The recently published National Defense Industrial Strategy (NDIS) is aimed at fortifying the nation's defense manufacturing and technology supply chains to match evolving threats. Her comments align with IPC’s efforts to help fortify supply chains and foster innovation in electronics manufacturing. Read the article in Defense One. IPC Contact:  Rich Cappetto.

 

ENVIRONMENT AND HEALTH

Japan Seeks Public Input on Designating PFOA Compounds as Hazardous: Japan’s Ministry of Health, Labour and Welfare (MHLW), Ministry of Economy, Trade and Industry (METI), and Ministry of Environment (MoE) are considering amendments to the Enforcement Ordinance of the Chemical Substance Control Law (CSCL). The proposed revisions would designate PFOA isomers, their salts, and PFOA-related compounds (perfluorooctyl iodide and 8:2 fluorotelomer alcohol) as Class I Specified Chemical Substances, which are known to persist in the environment, posing long-term health risks to humans. If these changes are approved, businesses will need permission to make or bring these substances into Japan in accordance with the CSCL. Beginning this winter, products containing these chemicals won't be allowed to be imported, including anti-reflective agents utilized in semiconductor manufacturing. The public input period ended today. IPC Contact: Kelly Scanlon.

 

TECHNOLOGY

U.S. Commerce Secretary Sees Beyond Just Chips: U.S. Commerce Secretary Gina Raimondo this week again demonstrated that she sees the entire electronics supply chain, not just chips, as crucial to U.S. prosperity and security. During a recent event in DC on the CHIPS and Science Act, hosted by the Center for Strategic and International Studies, Raimondo called for bringing “the entire supply chain” for semiconductors to the United States and predicted that by 2030, the United States will be “the only country in the world where you can invent new chip architecture, design, manufacture, and package the chips, all in America.” IPC’s Rich Cappetto had a chance to speak with her briefly and reinforced her awareness of the role of electronic interconnection technologies, as well as IPC’s efforts to foster a skilled workforce in our industry. Kudos to the CSIS and the CHIPS Office for collaborating on this insightful event. Watch Secretary Raimondo’s remarks and read the full transcript. IPC Contact: Rich Cappetto.

European Commission Spotlights Advanced Materials in New ReportThe European Commission has unveiled a new report on advanced materials, outlining its proposed strategy to cultivate industrial leadership through Research and Innovation (R&I) and widespread deployment. The strategy aims to bolster the EU's long-term competitiveness by positioning it as a leader in emerging material technologies. It pledges support for the development, testing, and implementation of these materials. IPC, in a recent engagement, provided crucial insights to the European Commission to inform the development of this communication. Our contributions underscored the indispensable "silicon-to-systems" framework, ensuring a comprehensive approach to addressing the electronics sector's requirements. For more on what this means to our industry, read the IPC Blog. IPC Contact: Alison James.

 

TRADE AND SUPPLY CHAIN

European Commission Spotlights EU Competitiveness in New Report: Recently, the European Commission unveiled its highly anticipated Annual Single Market and Competitiveness Report, offering a comprehensive overview of the vitality and challenges within the Single Market. This marks the first instance in which the electronics sector has been recognized for its critical role and its longstanding dependencies on other regions. IPC is actively engaging with the European Union to emphasize the significant scope and scale of these dependencies, particularly in areas such as PCBs, EMS capacities, and IC substrates. These dependencies play a pivotal role in shaping the region's industrial competitiveness and resilience. IPC will continue to advocate for a holistic, “silicon-to-systems” industrial strategy to address these challenges head-on. IPC Contact: Alison James.

 

UPCOMING EVENTS

Navigating Plastics Use and Management in the Electronics Value Chain (Webinar): March 27, 12:00-1:00 pm EDT. Join IPC and the Information Technology Industry Council (ITI) for an insightful webinar on navigating plastics use and management in the electronics value chain. With experts from the U.S. State Department and Beveridge & Diamond, this event will delve into environmental and regulatory considerations, global treaties, and implications for product design and manufacturing practices. Register today!

IPC APEX EXPO 2024: Anaheim, Calif., April 6-11. The largest electronics manufacturing event in North America, APEX features the newest innovations and the best minds in the industry. APEX 2024 will also host the Electronic Circuits World Convention 16, an international PCB symposium held every three years, featuring the latest information on global PCB demand, PCB manufacturing processes, and promoting the domestic PCB industry in every country and every region. Register by TODAY for a 20% discount!

 

PLEASE "LIKE" AND "SHARE" OUR LINKEDIN POSTS

 

I was pleased to visit briefly this morning with U.S. Commerce Secretary Gina Raimondo following her inspirational remarks at Center for Strategic and International Studies (CSIS) on the status of CHIPS Act implementation. I emphasized the importance of electronic interconnection as an enabling technology for semiconductors, and the need to invest in and support the growth of a silicon to systems ecosystem including printed circuit board manufacturing, electronic assembly, and suppliers. I also shared the important work that the IPC Education team is doing by building a talent pipeline, including industry-recognized career paths and apprenticeship programs, to build a skilled workforce at the scale needed to serve #electronicsmanufacturing industry.

IPC applauds the announcement by the U.S. Government of $300M in funding for R&D activities that establish and accelerate domestic capacity for advanced packaging substrates and substrate materials. This is an important milestone to build a more resilient semiconductor manufacturing supply chain in North America by boosting related technologies that are crucial for advanced semiconductors to function. IPC has identified substrates as one of the most urgent areas for government encouragement.

KEEP IN TOUCH WITH US 

Meet the IPC GR Team: Whether it is engaging with policymakers in the Americas, the European Union, or Asia, the IPC Government Relations (GR) Team proactively seeks opportunities to educate, inform and influence policymakers on policies that spur innovation, growth and competition, while protecting human health and the environment. But our success depends on your support and engagement. Learn more and get involved in IPC advocacy today! IPC Contact: Chris Mitchell.   

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