Chris Mitchell
Vice President, Global Government Relations

The Headlines at a Glance: 

TOP NEWS OF THE WEEK 

• Cautious Optimism on First Anniversary of Biden’s Action on Defense Electronics

QUOTE OF THE WEEK 

• On PCBs Being a Key Component of Advanced Defense Technologies

TECHNOLOGY 

• IPC Applauds White House’s Microelectronics Strategy
• What President Biden's FY2025 Budget Proposal Means for Electronics Industry

DEFENSE & NATIONAL SECURITY 

• U.S. Defense Spending Deal a Good Result for PCBs and Advanced Packaging
• European Commission Unveils Groundbreaking “Defence Industrial Strategy”

ENVIRONMENT AND HEALTH

• IPC's Collaborative Approach to Advocating for Sustainable Electronics
• IPC Leads Industry Efforts in Navigating Complexities of PFAS Regulations

IPC ANNOUNCEMENTS

• Devan Iyer to Strengthen IPC's Advocacy for Advanced Packaging

UPCOMING EVENTS

• Women Reshaping the Engineering Landscape (Webinar), June 24
• IPC APEX EXPO 2024, April 6-11

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TOP NEWS OF THE WEEK

Cautious Optimism on First Anniversary of Biden’s Action on Defense Electronics: This week marks the first anniversary of President Joe Biden's “presidential determination” on defense electronics, which paved the way to U.S. government investments in printed circuit boards (PCBs), advanced packaging, and IC substrates. Looking ahead, we’re cautiously optimistic.  Notably, the recent FY24 spending deal allocates $587.9 million for Dept. of Defense purchases under the Defense Production Act (DPA), a better result than we expected, due in part to IPC’s advocacy efforts on behalf of the industry. On the other hand, there is still no explicit commitment to a comprehensive “silicon-to-systems” strategy to bolster the rest of the electronics manufacturing ecosystem beyond chips; and the Administration’s FY25 budget proposal would cut the DPA account and include no earmark for PCBs, advanced packaging, or IC substrates. IPC will be keeping up our advocacy work to try and avoid stalled momentum. Read more on the IPC blog; see also the related item under DEFENSE & NATIONAL SECURITY below. IPC Contact: Rich Cappetto.

QUOTE OF THE WEEK

TECHNOLOGY

IPC Applauds White House’s Microelectronics Strategy: Earlier this month, the White House Office of Science and Technology Policy (OSTP) unveiled a strategy aimed at catalyzing microelectronics innovation in the United States. Aligned with the bipartisan CHIPS Act, the National Strategy on Microelectronics Research sets forth ambitious objectives for the coming five years. IPC was pleased to see advanced packaging, test, and assembly mentioned, and the emphasis on fostering a supportive ecosystem including materials, substrates, and interconnect technology was on target. IPC’s 2021 report on advanced packaging was also cited as a guiding reference. You can be sure IPC will refer to this strategy often as our advocacy continues, emphasizing a “silicon-to-systems” approach. IPC Contact:  Rich Cappetto.

What President Biden's FY2025 Budget Proposal Means for Electronics Industry: On the heels of his State of the Union Address earlier this month, U.S. President Joe Biden released his budget for fiscal year 2025 the following week. IPC applauds certain aspects of the budget, particularly the increased investment of $1.4 billion in STEM education and workforce development, and the $50 million increase for apprenticeship funding, which is crucial for nurturing talent in our industry. While we also welcome the boost in funding for industry-relevant agencies like the Department of Commerce and the National Science Foundation, we stress the importance of ensuring these investments align with a holistic “silicon-to-systems” approach. On the other hand, we are concerned by proposed tax increases on corporations, as it could hinder growth and innovation. IPC Contact: Rich Cappetto.

DEFENCE AND NATIONAL SECURITY

U.S. Defense Spending Deal a Good Result for PCBs and Advanced Packaging: In a win for the electronics manufacturing industry, the fiscal 2024 spending deal enacted last week by Congress and signed by President Biden includes $587.9 million for Defense Production Act (DPA) purchases, including purchases called for under President Biden’s 2023 Presidential Determination which names domestic printed circuit boards (PCBs) manufacturing as essential to U.S. national security. These funds had been on the chopping block, and IPC swung into action to defend them throughout the budget negotiation process. As a result, the funding provided for DPA purchases is $156 million more than the low end of the negotiation, and an explanatory statement says, “The Secretary of Defense is encouraged to prioritize Defense Production Act investments in support of domestic printed circuit board fabrication.” IPC now calls on the Pentagon to proceed with allocating the full $85 million it had budgeted for PCBs and advanced packaging in FY24. Meanwhile, there is no time to rest; IPC now must turn to the even bigger challenge of ensuring that funding for the electronics ecosystem continues in FY25. The administration’s recent FY25 budget proposal contains a 33% reduction for the Defense Production Act below the FY24 anticipated funding level. Even more troubling, no additional funds are requested for PCB and advanced packaging beyond those approved in FY23 and FY24. Unless this is corrected, it could result in stalled momentum in 2025 and beyond. IPC Contact: Rich Cappetto.

European Commission Unveils Groundbreaking “Defence Industrial Strategy”: The European Commission recently introduced the EU's first-ever Defence Industrial Strategy,” including provisions of interest to our industry. In its statement, the European Commission noted that the Defence Industrial Strategy “sets a clear, long-term vision to achieve defence industrial readiness in the European Union,” a goal that requires member states to “invest more, better, together and European.” The strategy notes that the EC has already established an EU Observatory of Critical Technologies to identify dependencies on non-EU sources of critical technologies, with work having started on Electrical, Electronic and Electro-mechanical (EEE) semiconductor-based components and autonomous systems technologies. Accompanying the strategy is a legislative proposal for the European Defence Industry Programme (EDIP) and a framework of measures to ensure the timely availability and supply of defense products. IPC is actively evaluating the strategy and welcomes opportunities to enhance defense electronics manufacturing in Europe. IPC Contact: Alison James.

ENVIRONMENT & HEALTH

IPC's Collaborative Approach to Advocating for Sustainable Electronics: The call for sustainability in the electronics industry reverberates globally, marking a pivotal moment in our history. With a commitment to fostering change, IPC is actively engaged in empowering manufacturers to navigate this transformative journey. Through industry standards, workforce training, certification programs, and advocacy efforts, IPC champions a collaborative approach to address sustainability challenges head-on. As Dr. John W. Mitchell, president and CEO of IPC, underscores in the latest issue of PCB007 Magazine, the industry's future hinges on concerted efforts to build electronics sustainably, embracing conscientious lifecycle management and resource efficiency. IPC will continue to facilitate dialogue and innovation to shape a more sustainable future for all. Read more in PCB007 Magazine. IPC Contact: Kelly Scanlon.

IPC Leads Industry Efforts in Navigating Complexities of PFAS Regulations: In the ongoing dialogue surrounding environmental sustainability and industry regulations, the treatment of per- and polyfluoroalkyl substances (PFAS) has emerged as a critical focus area. Dr. Kelly Scanlon, lead sustainability strategist at IPC, sheds light on the complexities of PFAS and the advocacy efforts surrounding them in the latest issue of PCB007 Magazine. With over 10,000 PFAS chemistries complicating the task of setting definitions and regulations, IPC has been actively engaged in policy actions both in the U.S. and the EU for several years. From responding to proposed restrictions under the REACH Regulation to facilitating educational events and webinars, IPC continues to spearhead initiatives aimed at fostering a common understanding of PFAS regulation. Read more in PCB007 Magazine. IPC Contact: Kelly Scanlon.

IPC ANNOUNCEMENTS

Devan Iyer to Strengthen IPC's Advocacy for Advanced Packaging: IPC this month welcomed Devan Iyer, Ph.D., as its chief strategist for advanced packaging, as we reinforce our commitment to advocating for a “silicon-to-systems" approach to the semiconductor industry. With extensive expertise garnered from roles in leading companies including Amkor Technology Inc. and Texas Instruments, Dr. Iyer will play a pivotal role in IPC's efforts to collaborate with electronics companies and governments. As governments in North America and Europe intensify support for advanced packaging initiatives, IPC is poised to actively engage in programs like the CHIPS for America R&D Office's funding opportunities. Dr. Iyer's addition further solidifies IPC's position as a premier advocate for advanced packaging technologies, enhancing its influence in shaping policies and programs crucial to the industry's future. Connect with Devan Iyer on LinkedIn. For more information, visit Advanced Packaging Semiconductors | IPC Industry Initiatives.

IPC APEX EXPO 2024: Anaheim, Calif., April 6-11. The largest electronics manufacturing event in North America, APEX features the newest innovations and the best minds in the industry. APEX 2024 will also host the Electronic Circuits World Convention 16, an international PCB symposium held every three years, featuring the latest information on global PCB demand, PCB manufacturing processes, and promoting the domestic PCB industry in every country and every region. Register today!

Bold Breakthroughs: Women Reshaping the Engineering Landscape (Webinar): June 24, 10:00-11:00 am EDT. Join IPC for this special virtual event in celebration of International Women in Engineering Day. This event will shine a spotlight on the incredible women in the electronics industry who are breaking barriers, making bold breakthroughs, and paving the way for future generations. Led by IPC’s Teresa Rowe, Senior Director of Assembly & Standards Technology, panelists include nine extraordinary women from nine different countries. Register today for FREE!

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		“An apprenticeship is a great on-ramp for a manufacturing career.” Cory Blaylock, IPC’s director of workforce partnerships, talked to Zach Peterson, host of Altium’s “OnTrack: The PCB Design Podcast,” about the importance of bridging the generational gap in the electronics industry.
In a current blog post, Richard Cappetto, IPC senior director, North American government relations, explains the positive aspects of the Presidential Determination, along with the challenges ahead, including why the U.S. government must make “a clear, unambiguous commitment to a silicon-to-systems strategy.”

KEEP IN TOUCH WITH US 

Meet the IPC GR Team: Whether it is engaging with policymakers in the Americas, the European Union, or Asia, the IPC Government Relations (GR) Team proactively seeks opportunities to educate, inform and influence policymakers on policies that spur innovation, growth and competition, while protecting human health and the environment. But our success depends on your support and engagement. Learn more and get involved in IPC advocacy today! IPC Contact: Chris Mitchell.   

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