IPC Global Advocacy Report

5/24/24

Dear IPC Members,

This week’s top news is the CHIPS for America Program’s announcement of a $75 million investment in IPC member company Absolics to advance domestic IC substrate capabilities. IPC applauds this action, which is consistent with the “silicon-to-systems” approach that IPC advocates for the various government chips programs. Read on to learn more.

On the environmental front, IPC recently submitted comments to the U.S. EPA regarding the safe use of formaldehyde in electronics, expressing concern over the agency's Draft Risk Evaluation. IPC contests the determination of unreasonable risks to workers and raises issues regarding the evaluation process and the limited public comment period. See IPC’s full comments below.

The IPC Government Relations Team continues advocating for our industry in the halls of government, and we always welcome your comments and questions.

Chris Mitchell
Vice President, Global Government Relations

 

The Headlines at a Glance: 

TOP NEWS OF THE WEEK 

  • IPC Applauds $75M U.S. Government Investment in Substrate Technology
  • Washington Workshop on IC Substrates Draws Defense, Civilian Leaders

QUOTE OF THE WEEK 

  • On the Importance of Substrate Innovation for Revitalizing the U.S. Electronics Industry

IPC ADVOCACY AND YOU 

  • IPC Members Advocate for Industry-Friendly Policies at Impact Day in D.C.
  • Pledge to be Involved in IPC Advocacy

ENVIRONMENT & SUSTAINABILITY

  • IPC Submits Comments to U.S. EPA on Safe Use of Formaldehyde in Electronics
  • IPC Evaluating Potential Impact of New U.S. EPA Rule on Methylene Chloride

EDUCATION AND WORKFORCE

  • IPC Appeals to Potential Young Apprentices in Baltimore

UPCOMING EVENTS

  • Electronics Goes Green: Berlin, Germany, June 18-20
  • Women Reshaping the Engineering Landscape: Webinar, June 24
  • Chemical Management for Electronics USA: Boston, Mass. and Virtual, June 24-25

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TOP NEWS OF THE WEEK

IPC Applauds $75M U.S. Government Investment in Substrate Technology: The Biden-Harris Administration has announced preliminary terms with IPC member company Absolics Inc., a subsidiary of South Korea-based SKC, for a $75 million investment in substrate technology needed for advanced semiconductors and advanced packaging. The funding, being provided under the CHIPS and Science Act, will establish a 120,000 square-foot facility in Covington, Georgia, with a goal to create over 1,200 jobs and strengthen U.S. technological leadership across the semiconductor supply chain. Absolics also will work with Georgia Tech to continue relevant R&D and expand the local talent pipeline. IPC applauds this investment, which is consistent with IPC’s call for more investment in advanced packaging and a “silicon-to-systems” approach to the various government chips programs. This is the U.S. Government’s first investment in IC substrates through the CHIPS incentive grants, and it can't be the last! Read more in the announcement from the CHIPS for America program and in Fierce Electronics. IPC Contact: Rich Cappetto

Washington Workshop on IC Substrates Draws Defense, Civilian Leaders: Last week, IPC and the U.S. Partnership for Assured Electronics (USPAE) jointly convened a workshop in Washington, DC on how to bolster U.S. integrated circuit (IC) substrate capabilities. This event gathered key government and electronics industry leaders to advance a Department of Defense-funded project aimed at addressing the nation's deficiencies in IC substrate manufacturing. The project was awarded to a USPAE/IPC team in October, and a final study is due to DoD in June. Panel discussions and breakout groups tackled critical areas such as technology, standards, workforce development, and financial competitiveness. Speakers included industry experts from IPC and USPAE; the DoD’s CHIPS Coordination Cell; the DoD Industrial Base Analysis and Sustainment Office (IBAS); the U.S. Naval Surface Warfare Center in Crane, Indiana; and the CHIPS National Advanced Packaging Manufacturing Program (NAPMP). IPC Contact: Joe O’Neil.

 

QUOTE OF THE WEEK

Creating a broad-based advanced packaging ecosystem is crucial to the success of revitalizing the U.S. semiconductor industry, and this all begins with substrates. Supporting innovation of the substrate can improve performance and reduce power needs in advanced packaging technologies which are critical to the needs of artificial intelligence capabilities and high-performance computing.”

—  Laurie Locascio, U.S. Under Secretary of Commerce for Standards and Technology, and Director of NIST, from the announcement of a $75 million investment in integrated circuit substrate technology.

 

IPC ADVOCACY AND YOU

IPC Members Advocate for Industry-Friendly Policies at Impact Day in D.C.: Leaders of IPC member companies gathered in Washington, D.C. earlier this month for IPC Impact Day, engaging with federal officials on crucial industry policies. For example, we urged Congress to fund the Presidential Determination on PCBs; take up H.R. 3249, the Protecting Circuit Boards and Substrates Act; support incentives for workforce training and industry certifications; and implement a "Silicon-to-Systems" approach to the CHIPS Act. Attendees from a half-dozen companies represented the interests of the electronics manufacturing industry and made our collective voices heard. Read more in this IPC Blog, and let us know if you’d like to participate in a future Impact Day. IPC Contact: Rich Cappetto.

Pledge to be Involved in IPC Advocacy: The IPC Government Relations team works for you year-round. But our success depends on active participation from IPC members like you! Please visit the IPC Action Alert Center and pledge to stay involved in IPC advocacy. We will send you timely action alerts and make it easy to communicate with your elected officials with just a few clicks.  IPC Contact: Rich Cappetto.

 

ENVIRONMENT AND SUSTAINABILITY

IPC Submits Comments to U.S. EPA on Safe Use of Formaldehyde in Electronics: IPC, which is dedicated to ensuring the safe use of formaldehyde in electronics products through collaboration with its member companies, recently submitted comments to the U.S. Environmental Protection Agency (EPA) on the agency’s Draft Risk Evaluation for formaldehyde. Representing its member companies, IPC contests the EPA’s determination of unreasonable risks to workers who use formaldehyde as a reducing agent in electroless copper formation, citing discrepancies with real-world conditions. Concerns also arise from EPA’s apparent haste in completing the draft risk evaluation, which may have compromised the quality, reliability, and integrity of information about risks in electronics manufacturing. Additionally, IPC expresses apprehension over the limited 60-day public comment period for a document spanning thousands of pages. Read IPC’s full comments and let us know how this impacts your company. IPC Contact: Kelly Scanlon.

IPC Evaluating Potential Impact of New U.S. EPA Rule on Methylene Chloride: The U.S. EPA recently finalized a risk management rule for methylene chloride under the Toxic Substances Control Act (TSCA). The rule seeks to ban all consumer and most commercial and industrial uses of methylene chloride, including uses in electrical equipment, appliance, and component manufacturing. The applications that EPA is allowing to continue will be subject to new mandates under a Workplace Chemical Protection Program. IPC is currently working to understand the potential impacts of this rule on the electronics manufacturing industry. IPC members are encouraged to read the final rule and get involved in upcoming stakeholder engagement opportunities. IPC Contact: Kelly Scanlon.

 

EDUCATION AND WORKFORCE

IPC Appeals to Potential Young Apprentices in Baltimore: During National Youth Apprenticeship Week earlier this month, IPC and friends participated in a Career Expo hosted by Baltimore County Public Schools at Community College of Baltimore County. We promoted careers in electronics manufacturing, talked to many students, and made connections with county and state officials about bringing IPCs credentialing and education opportunities into more schools. Kudos to our partners Zentech Manufacturing and Institute for American Apprenticeships at Vermont HITEC Inc. for joining us. Check out the photos and “color commentary” on LinkedIn, and let us know if you want to help IPC inspire our youth by exposing them to career opportunities in our industry. IPC Contact: Cory Blaylock.

 

UPCOMING EVENTS

Electronics Goes Green: Berlin, Germany, June 18-20: IPC is a proud sponsor of Electronics Goes Green 2024, From Silicon to Sustainability. This global event features researchers, policymakers, and industry players dedicated to driving sustainability in electronics and in-circuit testing. Featured topics include environmental effects of mature, as well as emerging technologies and materials; life cycle assessment (data) of specific electronic components; LCA data management along the supply chain; fair, clean, and conflict-free electronics; and circular economy strategies. Register today.

Bold Breakthroughs: Women Reshaping the Engineering Landscape: Webinar, June 24, 10:00-11:00 am EDT: Join IPC for this special virtual event in celebration of International Women in Engineering Day. This event will shine a spotlight on the incredible women in the electronics industry who are breaking barriers, making bold breakthroughs, and paving the way for future generations. Led by IPC’s Teresa Rowe, Senior Director of Assembly & Standards Technology, panelists include nine extraordinary women from nine different countries. Register today for FREE!

Chemical Management for Electronics USA: Boston, Mass. and Virtual, June 24-25; What is the risk evaluation and management status of high-priority chemicals relevant to electronics manufacturers? Kelly Scanlon, IPC’s lead sustainability strategist, will provide details in her presentation, “Where TSCA and Electronics Manufacturing Intersect: The Essential Voice of Industry,” on June 24. IPC sponsors this two-day conference focusing on the complex and changing landscape of chemicals management for electrical and electronic equipment (EEE) in the United States and beyond. IPC members, use code IPC15 for a 15% discount when registering.

 

PLEASE "LIKE" AND "SHARE" OUR LINKEDIN POSTS



Congratulations to Absolics Inc. on its preliminary agreement with the U.S. Department of Commerce for up to $75 million in direct funding under the CHIPS and Science Act to help advance domestic glass substrate capabilities. Developing these capabilities is vital to U.S. leadership in semiconductor manufacturing.

 

As IPC is committed to working with its member companies to ensure the continued safe use of formaldehyde in electronics products, IPC submitted comments last week to the US Environmental Protection Agency (EPA) on the agency’s Draft Risk Evaluation for formaldehyde. Commenting on behalf of member companies, IPC does not believe that EPA’s determination of unreasonable risks to workers that use formaldehyde as an essential reducing agent in electroless copper formation is reflective of real-world conditions.

KEEP IN TOUCH WITH US 

Meet the IPC GR Team: Whether it is engaging with policymakers in the Americas, the European Union, or Asia, the IPC Government Relations (GR) Team proactively seeks opportunities to educate, inform and influence policymakers on policies that spur innovation, growth and competition, while protecting human health and the environment. But our success depends on your support and engagement. Learn more and get involved in IPC advocacy today! IPC Contact: Chris Mitchell.   

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