Dear IPC Members,
In our top news this week, the U.S. Dept. of Defense (DoD) announced an award of $30 million to IPC member TTM Technologies to ramp up production of ultra-high density (uHDI) printed circuit boards (PCBs) at a facility in Syracuse, New York. This award is a big deal for several reasons, as explained briefly below and in more detail on the IPC Blog.
Meanwhile, we’re asking our U.S. members to help us gain support for $45 million for PCB manufacturing in the U.S. defense budget for Fiscal Year 2025. Without House approval of this funding, the TTM award could be the last of its kind. Send a message to your U.S. Representative now, and consider hosting government officials or candidates at your facility.
And it’s not too late to join in our call for a “silicon-to-systems” strategy in Europe, where leaders are making plans to achieve “technological sovereignty.” Details below.
By the way, a recent IPC-hosted meeting on export controls provided rich information on preventing the flow of electronics technology to prohibited end-users.
As always, feel free to reach out to the IPC Government Relations Team with any questions or feedback. Our coordinates are below.
Best regards, |
Chris Mitchell
Vice President, Global Government Relations
The Headlines at a Glance:
TOP NEWS OF THE WEEK
- U.S. Awards $30M to TTM for UHDI Circuit Boards in a Win for “Silicon to Systems”
QUOTE OF THE WEEK
- IPC’s Chris Mitchell on Why the TTM Award is Such a Big Deal
ADVOCACY AND YOU
- Action Alert! Help Secure U.S. Defense Electronics Funding for Fiscal Year 2025
- New IPC Video Explains Advanced Packaging for Non-Technical Audience
- Become an IPC Workforce Champion and Inspire the Next Generation
DEFENSE AND SECURITY
- U.S. Defense Electronics Group Gathers in Search of New Opportunities
EUROPEAN UNION
- IPC Urges EU Ministers to Prioritize Electronics Manufacturing Competitiveness
- EC President Proposes New “Technological Sovereignty” Commissioner
OTHER HEADLINES IN THE NEWS
UPCOMING EVENTS
- The New Eco-design Regulation and Digital Product Passports: What the Electronics Industry Needs to Know (Webinar, October 30)
- IPC APEX EXPO 2025: Anaheim, California (March 15-20)
HELP US SPREAD THE WORD ON SOCIAL MEDIA
KEEP IN TOUCH WITH US
TOP NEWS OF THE WEEK
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U.S. Awards $30M to TTM for UHDI Circuit Boards in a Win for “Silicon to Systems”: The U.S. Dept. of Defense (DoD) this week announced an award of $30 million to IPC member TTM Technologies to ramp up U.S.-based production of ultra-high density (uHDI) printed circuit boards (PCBs) at a facility being developed in Syracuse, NY. The DoD said the award will “enable the timely delivery of cutting-edge technology to support vital defense programs.” This award is very significant for U.S. technology leadership and national security, as explained in more detail on the IPC Blog. Congratulations to TTM, and bravo to the DoD’s Manufacturing Capability Expansion and Investment Prioritization (MCEIP) directorate within the Office of the Assistant Secretary of Defense for Industrial Base Policy for their relentless push to close the gaps in the defense supply chain. The action comes amid ongoing advocacy by IPC and the U.S. Partnership for Assured Electronics (USPAE) for a U.S. Government "silicon-to-systems" strategy. However, additional defense PCB projects will be on the chopping block unless funding is restored in the final FY25 defense appropriations bill. You can help by visiting the IPC Action Alert Center to send a message to your U.S. representative. IPC Contacts: Chris Mitchell and Rich Cappetto.
QUOTE OF THE WEEK
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“The U.S. lacks robust domestic uHDI capabilities, which undercuts the nation’s ability to arm its warfighters with the latest and greatest technologies. This is not a future concern; this is a today problem. The DoD team, led by Anthony Di Stasio, is demonstrating that they understand the electronics supply chain better than some of their civilian peers, who seem to be in a silicon-only mindset.”
— IPC’s Chris Mitchell in an IPC Blog on why a Defense Department award to TTM Technologies is such a “big deal.” |
IPC ADVOCACY AND YOU
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Action Alert! Help IPC Secure U.S. Defense Electronics Funding: IPC is calling on you to take immediate action to support legislation that strengthens U.S. defense electronics manufacturing. As Congress finalizes government funding for Fiscal Year 2025, the Senate’s version includes $45 million for printed circuit board (PCB) manufacturing under the Defense Production Act (DPA) account. However, unless the House follows suit, this funding could drop to zero, leaving the U.S. dependent on non-domestic sources of the PCBs that power all defense electronics. Rep. Derrick Van Orden (R-WI) is circulating a letter that urges House appropriators to approve this funding. To support these efforts, click this link to send a message to your U.S. representative. It will only take you a minute, but it will make a difference. You might also consider hosting government officials or candidates at your facility; we can help arrange and support such visits. IPC Contact: Rich Cappetto.
New IPC Video Explains Advanced Packaging for Non-Technical Audience: A new 90-second video by IPC explains the concept of “advanced packaging” and why it is so important to electronics manufacturing and the world. The video is part of IPC’s ongoing efforts to educate government leaders and policy influencers on the need for a “silicon to systems” industrial strategy, a more holistic approach that boosts all the sectors involved in electronics manufacturing, not just semiconductor chips. The video is being distributed and promoted via all of IPC’s channels, and we invite you to help us in that process. Be sure to “like” and reshare the video from IPC’s LinkedIn account. Then send the link to any colleagues who need to see it and encourage them to share it, too. IPC Contact: Michelle Mermelstein.
Become an IPC Workforce Champion and Inspire the Next Generation: Do you know anyone who has a unique story to tell about their career in electronics manufacturing? IPC is seeking Workforce Champions—individuals who have excelled in the industry through hard work, skill development, and overcoming challenges. Whether they have advanced through apprenticeships, earned certifications, or non-traditional career paths, their stories can inspire others to pursue their own success in this dynamic field. IPC Workforce Champions will have opportunities to share their stories in any way that works for them, whether through speaking engagements, media interviews, or written content such as blogs and op-eds. By joining this network, your colleagues will receive professional support, including speaker training and media preparation, and they could even be considered for participation in industry events. Learn more on the IPC Blog; and complete this form to share your story now. IPC Contact: Michelle Mermelstein.
DEFENSE & SECURITY
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U.S. Defense Electronics Group Gathers in Search of New Opportunities: Last month, the U.S. Partnership for Assured Electronics (USPAE), an IPC subsidiary, gathered for their annual alliance partner and government stakeholder meeting in Arlington, Virginia. Under the theme of “Finding Opportunities,” attendees explored how industry and government can work together to improve electronics supply chain assurance and resiliency, particularly for U.S. defense systems and critical infrastructure. Industry leaders discussed their challenges and opportunities with representatives of the U.S. Department of Defense (DOD), NASA, large defense contractors, and others. Topics included how to enhance technology assurance standards; how to engage on defense market opportunities; and how to expand the skilled workforce to support defense electronics. Learn more on the USPAE website and contact Executive Director Jim Will for more information. And if you might be interested in efforts to boost U.S. regional electronics clusters, USPAE invites your insights on a short survey.
EUROPEAN UNION
IPC Urges EU Ministers to Prioritize Electronics Manufacturing Competitiveness: During last month’s meeting of the EU Competitiveness Council, IPC sent a letter to the Council President and key ministers, urging them to consider the recommendations outlined in our Industry Call to Action . With Europe’s electronics manufacturing sector facing a long-term decline, IPC stressed the need for a coordinated strategy to support electronics for critical industries such as defense and healthcare. The letter highlights that without intervention, Europe’s share of global electronics manufacturing could fall to 15% by 2035, weakening sectors like PCB production and advanced packaging. IPC calls for a renewed focus on strengthening Europe’s electronics manufacturing capabilities to ensure long-term industrial competitiveness. Read and help us boost the letter on LinkedIn. IPC Contact: Alison James.
EC President Proposes “Tech Sovereignty” Commissioner: Recently reelected to serve a second term, European Commission President Ursula von der Leyen recently announced to the European Parliament her proposed Commissioners-designate – akin to cabinet ministers – and structure for the nomination of Henna Virkkunen of Finland for Executive Vice-President or Technological Sovereignty, Security, and Democracy. This newly created role signals Europe’s growing focus on critical technologies in the upcoming mandate. European Parliament hearings on the nominees are expected in early November. IPC will remain engaged, continuing to advocate for a comprehensive silicon-to-systems industrial strategy as we share our Industry Call to Action. Learn more here and watch the President’s address to the European Parliament here. IPC Contact: Alison James.
TRADE AND SUPPLY CHAIN
U.S. Exports Watchdog Urges Due Diligence by Electronics Manufacturers: The U.S. Government is stepping up its focus on export controls, and electronics manufacturers must be vigilant as they are on the front lines of keeping U.S. technology in the right hands, according to a senior official who spoke to the IPC North American Executive Forum on Sept. 24. Matthew S. Axelrod, Assistant Secretary for Export Enforcement at the U.S. Department of Commerce’s Bureau of Industry and Security (BIS), urged IPC members to vet their customers thoroughly and adopt other best practices to help prevent the diversion of electronics components to prohibited end-users. Earlier in the day, the BIS made news with two announcements: new guidance on preventing the evasion of sanctions on Russia; and notice of a proposed rulemaking which would prohibit the import of certain software and hardware for connected vehicles. More details and resources are contained in this IPC Blog by Rich Cappetto.
Supply Chain Experts Focus on PCBs and AI Data Centers: A newly published recording of a government advisory body meeting reveals growing awareness of the key role of electronics in driving innovation, as well as risks in the electronics supply chain. As reported here previously, IPC participated in the September meeting of the U.S. Commerce Department’s Advisory Committee on Supply Chain Competitiveness, including a discussion of the needs of artificial intelligence (AI) data centers. As seen in Part I of the video recording, from minutes 38:00-40:00, the director of the department’s Supply Chain Center, Marti Flacks, said her team had studied the issue of AI data centers “from top to bottom,” and one of the “top” concerns that emerged is printed circuit boards (PCBs). “We know that AI data centers need … really high-end, multilayer PCBs, which have very concentrated production in just a few geographies …and are getting less attention than, for example, chips in terms of supply chain risk.” In keynote remarks, Commerce Secretary Gina Raimondo said, “And when you get into it, and you realize all the cooling systems, all the circuit boards, all the components come from China, it’s a very uncomfortable feeling.” The full recordings are posted here. Stay tuned for next week’s release of a new IPC white paper on electronics for AI data centers. IPC Contact: Rich Cappetto
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UPCOMING EVENTS
The New Eco-design Regulation and Digital Product Passports: What the Electronics Industry Needs to Know (Webinar, October 30 – In this webinar, we will dive into the Ecodesign for Sustainable Products Regulation (ESPR) and Digital Product Passports (DPPs), providing a clear explanation of what they are and how they work. Register for free webinar here.
IPC APEX EXPO 2025 – Anaheim, California, USA (March 15-20) – Discover the newest innovations and hear from the best minds in the electronics manufacturing industry. IPC APEX EXPO 2025 will be our industry’s largest event in North America, featuring a world-class trade show, professional development courses taught by industry experts, non-stop networking and more. Learn more here.
HELP US SPREAD THE WORD ON SOCIAL MEDIA!
KEEP IN TOUCH WITH US
Meet the IPC GR Team: Whether it is engaging with policymakers in the Americas, the European Union, or Asia, the IPC Government Relations (GR) Team proactively seeks opportunities to educate, inform and influence policymakers on policies that spur innovation, growth and competition, while protecting human health and the environment. But our success depends on your support and engagement. Learn more and get involved in IPC advocacy today! IPC Contact: Chris Mitchell.
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