– Joint statement by Henna Virkkunen and Maroš Šefčovič, the European Commission’s Vice President for Technological Sovereignty and Commissioner for Trade and Economic Security, respectively (see Top News above)

Application Window Open for U.S. Government Loans for Critical Techs: The application window for the U.S. Department of Defense’s Strategic Capital Equipment Finance program is now open through February 3. The DoD Office of Strategic Capital (OSC) is offering loans from $10 million to $150 million for capital investment and equipment purchases related to critical technologies in the defense supply chain. IPC has been facilitating OSC information-sharing with electronics industry leaders since last summer. Learn more about the loan program here and contact Rich Cappetto with any questions.

U.S. CHIPS Program Awards Advanced Packaging Facility to ASU: The U.S. Department of Commerce and Natcast, the non-profit entity that operates the National Semiconductor Technology Center (NSTC),  last week announced an award to Arizona State University (ASU) Research Park in Tempe, Ariz., for an Advanced Packaging Piloting Facility (PFF). The new facility “will enable researchers and industry leaders to develop and test new materials, devices, and advanced packaging solutions” in a “manufacturing-like” environment. This is the third facility awarded by the CHIPS for America Program, and it is expected to open in 2028. IPC has been a leading advocate for the development of advanced packaging capabilities in the United States. Our 2021 report on advanced packaging was cited in the agency’s strategic plan document for the National Advanced Packaging Manufacturing Program (NAPMP). IPC Contact: Devan Iyer.

EC Responds to Proposed U.S. Limits on AI Chips Exports: The European Commission’s new leaders on technology, trade and economic security this week responded to the Biden Administration’s proposed measures to limit exports on advanced AI chips. The Biden administration proposed the limits on Monday. Under the proposal, 17 EU member countries would have their access to microchips needed to train AI models capped, while 10 others would face no restrictions, Euractiv reports. The joint statement by EC Executive Vice-President Henna Virkkunen and Commissioner Maroš Šefčovič urged the U.S. to keep exports uncapped for all EU countries and looks forward to engaging with the incoming U.S. administration “to maintain a secure transatlantic supply chain on AI technology and super computers.” IPC will continue to monitor the action for implications for electronics and welcomes member input. IPC Contact: Alison James.

Brussels Releases Guidance on Outbound Investment Screening: The European Commission on Wednesday released a much-delayed recommendation to EU countries on the oversight of outgoing investments in three priority sectors: semiconductors, artificial intelligence and quantum technologies. The recommended scope of technologies for review is broad, including “assembly, testing and packaging of integrated circuits and other semiconductors, including advanced printed circuit boards and packaging.” The recommendation springs from the EU’s economic security strategy unveiled over a year ago by EC President Ursula von der Leyen, aiming to safeguard sensitive technology, research, and infrastructure. The screening proposed exercise would run until June 2026 and include investments dating back to January 2021. The review of outbound investments will inform a decision on whether further action is needed – at EU and/or national levels - to address any risks identified. As always, IPC will continue to monitor the implications for electronics, and we welcome your input. IPC Contact: Alison James.

European Commission Standing by for Five-Year Plan: As the European Commission is beginning its work for 2025, an early initiative will be the “Competitiveness Compass,” which EC President Ursula von der Leyen is expected to publish later this month. Drawing from recent landmark reports by statesmen Mario Draghi and Enrico Letta, the initiative aims to be a five-year blueprint to tackle the EU’s innovation gap with global rivals, ensure the bloc’s economic security, and make progress on decarbonization. IPC and our partners will be watching for the release of this plan, now expected on 29 January, and we will continue to engage with EU leaders to emphasize the vital role of Europe’s electronics manufacturers in achieving the EU’s goals. Learn more about IPC’s European advocacy work and our Industry Call to Action on our EU Advocacy home page.  IPC Contact: Alison James.

Taiwan May Shift More of its Tech Supply Chain to U.S.:  The government of Taiwan will support moving more of its supply chains for autos and information technology to the United States, Bloomberg reports (subscription required). At a briefing in Taipei, Minister of Economic Affairs Kuo Jyh huei said these industries are likely to face the greatest impact from U.S. President Donald Trump’s planned tariff hikes. Taiwan also plans more research and development cooperation with the U.S. in the space sector, and it may buy more energy from U.S. suppliers. IPC Contact: Sydney Xiao.

European Commission Proposes New Exemptions Under RoHS: The European Commission has published three revised exemptions under the Restriction of Hazardous Substances Directive (RoHS), with significant implications for electronics. The exemptions are:

• Hazardous substances – exemption for lead in high melting temperature type solders
• Haz ardous substances – exemption for lead in glass or in ceramic of electrical and electronic components
• Hazardous substances – exemption for lead as an alloying element in steel, aluminium, and copper

The RoHS Directive restricts the use of certain hazardous substances in electrical and electronic equipment if they can be replaced by safer alternatives. Under certain conditions, the RoHS Directive allows for temporary exemptions. Some of the newly proposed exemptions are amendments, and some are extensions. Among the recommended extensions, several will expire by end of 2026, meaning any further extension requests will need to be submitted to the EC by the end of June 2025. Related to these actions, the EC has published three draft Delegated Directives for public consultation: here, here, and here, respectively. The deadline for public comments is 10 February. IPC is planning to consolidate industry input. IPC Contact: Diana Radovan.

Contribute Your Ideas on EU’s Digital Product Passports for PCBs: Two of the EU’s key standard-setting bodies for electronics are hosting a virtual workshop on Monday to kick off discussions on the development of Digital Product Passports (DPPs) for PCBs. DPPs, introduced under the European Commission’s Ecodesign for Sustainable Products Regulation, are envisioned as digital identity cards for products, providing key data on sustainability, recyclability, and environmental impact. The workshop initiative, launched by CEN and CENELEC, will define essential data requirements for DPPs in the PCB sector and explore how they can support sustainability and reduce Europe’s reliance on non-EU suppliers. Led by Paolo Rosa of Politecnico di Milano, the workshop will bring together PCB manufacturers, OEMs, recyclers, policy experts, and other stakeholders to shape the future of PCB standards. Contact IPC’s Diana Radovan to join in consolidated industry comments. Learn more on the IPC Blog.

WHMA Annual Global Leadership Summit 2025 (Fort Myers, Florida), Jan. 28-30: The wire harness industry is constantly evolving with new technology and practices. The 2025 WHMA Annual Global Leadership Summit offers the tools you need to help your business succeed in this fast-changing landscape. This is a networking event for executives representing wire harness manufacturers, OEMs and suppliers for companies that build wiring harnesses and cable assemblies. Learn more and register here.

PEDC-Pan-European Electronics Design Conference (Viena, Austria), Jan. 29-30. Co-hosted by FED and IPC, the conference is held on two days, in English, highlighting the latest developments in electronics design, from “Silicon-to-Systems” to the role of AI in design. Topics include development, design for excellence, software and tools, design process of electronic systems and the “green line” throughout the electronics product life cycle. Learn more and register here.

IPC EMS Leadership Roundtable: Public Policy and Your Business (Washington, D.C.), Feb. 19-20: If you care about the future of the EMS sector, join us in DC to dive into key policy topics, network with industry leaders, enjoy a reception and dinner, and participate in optional meetings with policymakers to shape the future of EMS. Learn more and register here.

IPC APEX EXPO 2025 (Anaheim, California), Mar. 15-20: Discover the newest innovations and hear from the best minds in the electronics manufacturing industry. IPC APEX EXPO 2025 will be our industry’s largest event in North America, featuring a world-class trade show, professional development courses taught by industry experts, non-stop networking and more. Learn more and register here.

The topic is EMS and how AI, inflation, tariffs, and market shifts will affect the industry. For insights into emerging trends in EMS, see the latest issue of SMT007 magazine for an in-depth interview with Dennis Reed, Edgewater Research Company, and IPC’s Mark Wolfe, who told reporter Nolan Johnson why “EMS Leaders Should Plan Prudently in 2025.”

Join us in D.C., February 19-20, 2025, for the IPC EMS Leadership Roundtable: Public Policy and Your Business. Dive into key policy topics, network with industry leaders, enjoy a reception and dinner, and participate in optional meetings with policymakers to shape the future of EMS. Learn more and register.